A bit about us:
We are a global semiconductor company that develops products for high-voltage power conversion applications. We deliver the highest performance and highest reliability GaN devices and best-in-class applications-driven design support to a growing customer base. We create innovations that move beyond the limitations of silicon to capture 90% of today’s energy losses.
Why join us?
- Cutting Edge Technology!
- Great Benefits!
- Collaborative Team Environment!
- R&D Projects!
Job Details
SUMMARY:
This is a Senior/ Principal Level role to develop advanced packages for high performance power semiconductor products with high reliability, low cost and mass production capability by collaborating with related departments and suppliers around the world.
MUST HAVES:
DUTIES & RESPONSIBILITIES:
EDUCATION & EXPERIENCE:
This is a Senior/ Principal Level role to develop advanced packages for high performance power semiconductor products with high reliability, low cost and mass production capability by collaborating with related departments and suppliers around the world.
MUST HAVES:
- Hands-on Packaging Design Experience for (High Power) Products!
- Experience Modeling
- Experience with Multichip, Stacked Dies Packages
- Experience in Design, and Manufacturing
DUTIES & RESPONSIBILITIES:
- Analyze stress, thermal capability and electrical performance with in-depth knowledge of thermal-mechanical and electro-chemical interactions.
- Define BOM, assembly specification and qualification per standard requirements.
- Resolve package reliability issues with thorough knowledge in the whole assembly processes.
- Assembly process SPC, yield improvement, cost, throughput and capability analysis.
- Working with management and cross functional teams, help develop a packaging roadmap aligned with the company’s product roadmap and revenue targets.
- Work with device design / product engineering teams and external high volume packaging vendors. Complete reports, and production documentations.
EDUCATION & EXPERIENCE:
- Experience with various package generations, packaging schemes and production tools. Capable of defining clear BOM, assembly parameter optimization and qualification.
- Experience with ACAD software.
- Experience with package related design/simulation software.
- Bachelors in mechanical engineering, material science or similar required.
- 5+ years of experience in semiconductor packaging industry with hands-on design/engineering duties. Experience in semiconductor, microelectronics, direct bonded or plated Cu isolation, power packaging and assembly engineering including high current clip, various wire bonding and module assembly preferred.
- Experience in solder, epoxy processes, low thermal resistance interfaces, thermal fatigue of interfaces and wire bonding intermetallic growth mechanisms.
- Experience in multichip, stacked dies packages and assembly automation.
- Experience in qualification of high voltage/power packages. Qualification in very high humidity and corrosive environment a plus Experience in building a supply chain of vendors and service providers.
Jobot is an Equal Opportunity Employer. We provide an inclusive work environment that celebrates diversity and all qualified candidates receive consideration for employment without regard to race, color, sex, sexual orientation, gender identity, religion, national origin, age (40 and over), disability, military status, genetic information or any other basis protected by applicable federal, state, or local laws. Jobot also prohibits harassment of applicants or employees based on any of these protected categories. It is Jobot’s policy to comply with all applicable federal, state and local laws respecting consideration of unemployment status in making hiring decisions.
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By applying for this job, you agree to receive calls, AI-generated calls, text messages, or emails from Jobot, and/or its agents and contracted partners. Frequency varies for text messages. Message and data rates may apply. Carriers are not liable for delayed or undelivered messages. You can reply STOP to cancel and HELP for help. You can access our privacy policy here: jobot.com/privacy-policy
Sometimes Jobot is required to perform background checks with your authorization. Jobot will consider qualified candidates with criminal histories in a manner consistent with any applicable federal, state, or local law regarding criminal backgrounds, including but not limited to the Los Angeles Fair Chance Initiative for Hiring and the San Francisco Fair Chance Ordinance.
Information collected and processed as part of your Jobot candidate profile, and any job applications, resumes, or other information you choose to submit is subject to Jobot's Privacy Policy, as well as the Jobot California Worker Privacy Notice and Jobot Notice Regarding Automated Employment Decision Tools which are available at jobot.com/legal.
By applying for this job, you agree to receive calls, AI-generated calls, text messages, or emails from Jobot, and/or its agents and contracted partners. Frequency varies for text messages. Message and data rates may apply. Carriers are not liable for delayed or undelivered messages. You can reply STOP to cancel and HELP for help. You can access our privacy policy here: jobot.com/privacy-policy